Computex 2021: TeamGroup Announces its First DDR5-4800 Memory Moduleby Gavin Bonshor on June 7, 2021 2:00 PM EST
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- Computex 2021
Back in December 2020, TeamGroup announced its intentions for the switch to DDR5 memory on future platforms. During Computex 2021, TeamGroup claims it has 'successfully taken the lead over competing PCB manufacturers', with the first of its announced products for DDR5, the Elite DDR5-4800 16 GB module. Back at CES 2021, ADATA claimed that it has a DDR5 module in hand, but it sent us rendered images. We ultimately disapprove of this practice - don't state you have it in hand until you are ready to provide us actaul photographs of the thing. Unfortunately, TeamGroup has done the same here, providing renders. not photographs.
The Road to DDR5
Over the last year, we've highlighted certain aspects of DDR5 memory and what users can expect, including features, memory latency, and technological advancements over the current DDR4 memory. Some of which can be seen below:
- Here's Some DDR5-4800: Hands-On First Look at Next Gen DRAM
- Insights into DDR5 Sub-timings and Latencies
- Cadence DDR5 Update: Launching at 4800 MT/s, Over 12 DDR5 SoCs in Development
- DDR5 Memory Specification Released: Setting the Stage for DDR5-6400 And Beyond
TeamGroup's announcement hasn't come as a surprise given how long DDR5 has been speculated and discussed over the last year. One of the first platforms to supposedly feature DDR5 support is Intel's Alder Lake microarchitecture, which is expected to land in Q4 2021/Q1 2022. The first series of DDR5 from TeamGroup will be based on its 'Elite' memory series, with the first kit to feature speeds of 4800 MT/s, sub-timings of CL40-40-40-77, and will feature an operating voltage of 1.1 V.
One of the primary features of DDR5 is integrated on-die ECC, which is designed to improve overall system stability (but is actually more to do with yield). This is different to module-wide ECC, which DDR5 does not support by default (you still need a module-wide ECC module to support ECC technology). The information provided by TeamGroup say the Elite DDR5-4800 has double the banks compared to DDR4, with an all-black PCB. It is unclear whether or not the Elite DDR5-4800 will feature heatsinks, or they will operate with a bare PCB. We also know that it will feature 16 GB of capacity and will likely be sold as a dual-channel kit, and perhaps individually.
At present, there's no information on latency timings or how much the Elite DDR5-4800 16 GB module will cost, but TeamGroup does state that it will be unveiling its 'new generation' of products in September 2021.
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solidsnake1298 - Monday, June 7, 2021 - linkOof. Those timings. I know with the doubling of banks that there are performance advantages, I'm assuming with regards to throughput, but I wonder what the performance penalty is due to the latency of CL40 timings.
I'm currently running a kit of Samsung B-die at 3533MT @ 14-15-14-28 on a Ryzen 2700X (all secondary and tertiary timings also tuned according DRAM calculator). Scaling up the CL linearly from 3533MT to 4800MT comes out to about CL19. Even cheaper CL16 and CL18 kits would linearly scale to way below CL40.
I know, practically, it wouldn't work that way. But I'm just trying to point out that good, even average, DDR4 kits will have significant latency advantages for a while. Which was also the case when we transitions from DDR3 to DDR4.
I wonder how long it will be before we see the DDR5 equivalent of Samsung B-die.
jsz - Monday, June 7, 2021 - linkThis is completely reliant on CPU/Memory architecture.
- Intel for example actually benefits in terms of overall ns latency and super PI calculation synthetics due to tighter timings with "slower" ram. On AMD, "fast ram" outweighs tighter timings as long as within 1:1 Infinity Fabric.
-3200 CL14 bins were already out in 2015, not even a year after the transition period.
-Your 3533 MT/S cl14 tune is getting outperformed by any run of the mill 3600-3800 cl16-18 tune on a modern zen2/3 in AIDA. Timings aren't that relevant on AMD's current memory sub system. MT/s 1:1 to Infinity fabric is more important.
The only place where Samsung B-die has a legitimate advantage on current platforms is TRFC timings. They can be tuned lower than any other memory die on DDR4.
Techtree101 - Monday, June 7, 2021 - linkThis is how memory always works from generation to generation. It's not a linear scale. Ignore your preconceptions about timings and know that these are just fine for DDR5.
meacupla - Monday, June 7, 2021 - linkI understand it's just a render, but why is the PCB so tall and barren?
I don't even see open pads for more memory chips to be added on a 32GB model.
vikas.sm - Wednesday, June 16, 2021 - linkPlain-jane unregistered DDR5 is dense enough for 128gb dual rank on a single DIMM!
The render is for a 16GB DIMM, hence single-rank only. I guess they didn't bother rendering the second rank of contact pads.
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EliseMary - Monday, November 8, 2021 - linkWe eventually disapprove of this method; don't claim to have it in your possession until you're ready to show us actual images of the item. Unfortunately, TeamGroup has done the same thing in this case, supplying renders. photographs are not allowed.