Memory

Back in November last year, we reported that SK Hynix had developed and deployed its first DDR5 DRAM. Fast forward to the present, and we also know SK Hynix has recently been working on its DDR5-6400 DRAM, but today the company has showcased that it has plans to offer up to DDR5-8400, with on-die ECC, and an operating voltage of just 1.1 Volts. WIth CPU core counts rising with the fierce battle ongoing between Intel and AMD in the desktop, professional, and now mobile markets, the demand to increase throughput performance is high on the agenda. Memory bandwidth by comparison has not been increasing as much, and at some level the beast needs to be fed. Announcing more technical details on its official website, SK...

Micron to Start Volume Production of 128-Layer 3D NAND with RG Architecture This Quarter

As part of the company's second quarter financial earnings call, Micron has revealed that it is about to start volume production of its 4th Generation 3D NAND memory devices...

8 by Anton Shilov 6 days ago

Cadence DDR5 Update: Launching at 4800 MT/s, Over 12 DDR5 SoCs in Development

JEDEC still has not published the DDR5 specification officially, yet it looks like DRAM makers and SoC designers are preparing for the DDR5 launch at full steam. Cadence, which...

20 by Anton Shilov on 3/27/2020

TeamGroup Announces 32GB T-Force Vulcan Z and Dark Z DDR4 Modules

One of the world's largest DRAM memory manufacturers TeamGroup has unveiled its first DDR4 memory kits featuring 32 GB sticks under its gaming-focused T-Force brand. The T-Force Vulcan Z...

8 by Gavin Bonshor on 3/27/2020

Samsung to Produce DDR5 in 2021 (with EUV)

Samsung is on track to start volume production of DDR5 and LPDDR5 memory next year using a manufacturing technology that will take advantage of extreme ultraviolet lithography (EUVL). In...

20 by Anton Shilov on 3/25/2020

GlobalFoundries & Everspin Extend MRAM Pact to 12nm

GlobalFoundries and Everspin have announced that the two have extended their Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) to 12LP (12 nm FinFET) platform. The extension will enable GlobalFoundries...

4 by Anton Shilov on 3/13/2020

Rambus Develops HBM2E Controller & PHY: 3.2 Gbps, 1024-Bit Bus

The latest enhancements to the HBM2 standard will clearly be appreciated by developers of memory bandwidth-hungry ASICs, however in order to add support of HBM2E to their designs, they...

31 by Anton Shilov on 3/6/2020

ATP’s DDR4-3200 Industrial DIMMs: Up to 128GB @ 1.2V for AMD & Intel

ATP has unveiled its latest memory modules for servers and industrial applications, boasting a 3200 MT/s data transfer rate, an industry-standard voltage, and capacities ranging from 2 GB to...

7 by Anton Shilov on 3/5/2020

Samsung Starts Production of 16 GB LPDDR5-5500 for Smartphones

Samsung has begun mass production of the industry’s first 16 GB LPDDR5 memory for upcoming smartphones, such as the Galaxy S20 Ultra 5G handsets. The new DRAM devices not...

32 by Anton Shilov on 2/25/2020

SMART Modular Reveals 32 GB DDR4-3200 Low Profile Mini-DIMMs for Extreme Environments

SMART Modular has unveiled a new lineup of 32 GB Mini-DIMMs for extreme environments, such as industrial or telecommunication applications. The new high-density modules come in ULP (Ultra Low...

7 by Anton Shilov on 2/14/2020

G.Skill Launches 256 GB DDR4-3600 CL16 Memory Kit

The arrival of 32 GB unbuffered DIMMs has not only allowed mainstream systems to reach 128 GB of memory, but it's also allowed high-end desktops based on AMD Ryzen...

8 by Anton Shilov on 2/12/2020

SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM

SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by...

9 by Anton Shilov on 2/11/2020

GIGABYTE Launches Designare DDR4-3200 Memory, a 64 GB Kit

GIGABYTE is a relatively new player on the memory market, yet it clearly wants to participate in the premier league. As seen at CES, this week the company introduced...

22 by Anton Shilov on 2/6/2020

Micron Shipping LPDDR5 DRAM

Micron has announced their first LPDDR5 DRAM is in mass production and now shipping to customers. The new RAM is significantly faster and more power efficient than LPDDR4x. One...

32 by Billy Tallis on 2/6/2020

JEDEC Updates HBM2 Memory Standard To 3.2 Gbps; Samsung's Flashbolt Memory Nears Production

After a series of piecemeal announcements from different hardware vendors over the past year, the future of High Bandwidth Memory 2 (HBM2) is finally coming into focus. Continuing the...

24 by Ryan Smith on 2/3/2020

SK Hynix to Cut CapEx, Accelerate Transitions, 1z nm DRAM & 128L 4D NAND in 2020

Following a massive revenue and profitability drop in 2019, SK Hynix has announced that it plans to cut down its capital expenditures. While the market has shown some signs...

7 by Anton Shilov on 2/3/2020

Crucial’s 32 GB UDIMMs and SODIMMs Available: DDR4-2666 & DDR4-3200

In the summer of 2019, Crucial was among the first brands to demonstrate 32 GB unbuffered memory modules, which were based on Micron’s 16 Gb DDR4 chips. Now after...

12 by Anton Shilov on 1/29/2020

The Corsair DDR4-5000 Vengeance LPX Review: Super-Binned, Super Exclusive

The consumer memory industry has been teasing DDR4-5000 for a few months now. We saw one company show some DDR4-5000 modules at Computex back in July 2019, running...

54 by Gavin Bonshor on 1/27/2020

Here's Some DDR5-4800: Hands-On First Look at Next Gen DRAM

Just like all major makers of DRAM, SK Hynix produced its first DDR5 memory chips a couple of years ago and has been experimenting with the technology since then...

39 by Anton Shilov on 1/13/2020

CES 2020: Kingston’s HyperX Adds 32 GB UDIMMs & New Fury Speed Bins to Lineup

Kingston’s HyperX division introduced a stack of new memory modules at CES 2020. Firstly, the company added 32 GB unbuffered DIMMs and SO-DIMMs to its Fury and Impact families...

11 by Anton Shilov on 1/10/2020

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