Memory
SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The initiative is designed to speed up the adoption of HBM4 memory and solidify SK hynix's and TSMC's leading positions in high-bandwidth memory and advanced processor applications. The primary focus of SK hynix's and TSMC's initial efforts will be to enhance the performance of the HBM4 stack's base die, which (if we put it very simply) acts like an ultra-wide interface between memory devices and host processors. With HBM4, SK hynix plans to use one of TSMC's advanced logic process technologies to build base dies to pack additional features and I/O pins within the confines of existing...
Memory Scaling on Haswell CPU, IGP and dGPU: DDR3-1333 to DDR3-3000 Tested with G.Skill
‘How much does memory speed matter?’ is a question often asked when dealing with mainstream processor lines. Depending on the platform, the answers might very well be different...
91 by Ian Cutress on 9/26/2013
AMD Releases New Radeon Memory SKU: RG2133 Gamer Series
After entering the PC memory market about a year and a half ago, things have for the most part been quiet for AMD’s fledgling memory operations. With DDR3 enjoying...
24 by Ryan Smith on 5/8/2013
Micron and TE Connectivity Offer New Ultrathin DRAM Solutions
The push for smaller and thinner laptops, Ultrabooks, and tablets of late has come with some potentially undesirable side effects, namely the loss of flexibility. Of the Ultrabooks we’ve...
17 by Jarred Walton on 2/7/2013_carousel.jpg)
Crucial Demonstrates DDR4-2133 Modules
We’re not likely to be running DDR4 any time soon on desktops, and even most laptops are probably over a year away from getting the upgrade, but now is...
22 by Jarred Walton on 1/10/2013
G.Skill TridentX Review: 2x4GB at DDR3-2666 C11-13-13 1.65V
Next in our line of memory reviews is a kit I have actually had at my work desk for a while. In the land of overclockers, synthetics are...
28 by Ian Cutress on 10/28/2012
GeIL Evo Veloce Review: 2x8GB at DDR3-2400 C11-12-12 1.65 V
As part of a series of memory reviews, the next kit to enter our test beds is a limited edition enthusiast kit from GeIL. Attached with what GeIL...
30 by Ian Cutress on 10/24/2012
Memory Performance: 16GB DDR3-1333 to DDR3-2400 on Ivy Bridge IGP with G.Skill
Memory reviews are, in my opinion, actually quite hard to do. There are plenty of memory kits available that are nice and cheap, and the easy way to...
114 by Ian Cutress on 10/18/2012
Additional Details on Micron’s DDR3L-RS, DDR4-RS, and Other Memory
Earlier this week we posted a short write-up about Micron’s new DDR3L-RS memory. We didn’t have a lot of technical detail to go on at the time, but Micron...
24 by Jarred Walton on 9/22/2012
Micron Announces 30nm DDR3L-RS Products
Micron recently announced the availability of their 30nm DDR3L-RS (formerly DDR3Lm) memory, which could prove particularly beneficial for Ultrabooks and other ultrathin computing devices. Just what is DDR3L-RS memory...
10 by Jarred Walton on 9/20/2012
Samsung Introduces 64GB UHS-I microSD and SD Cards
Samsung has just announced two new memory cards, both capable of storing 64GB of data. One is a full sized SD card, suitable for devices such as cameras and...
5 by Stefan Constantinescu on 8/29/2012
Micron To Acquire Elpida For $2.5 Billion
And then there were 5. For the better part of a year now the DRAM industry has been in a lurch due to low prices. As a result of soft...
7 by Ryan Smith on 7/3/2012
Rambus And NVIDIA Bury The Hatchet, Sign 5 Year Agreement
While Rambus has settled in one form or another with most of the major players in the computing industry, one of the remaining holdouts has been NVIDIA. NVIDIA has...
20 by Ryan Smith on 2/9/2012
Micron CEO Steve Appleton Dies in a Plane Crash
Micron's long time CEO, Steve Appleton, has died in a plane crash at the age of 51 at the Boise Airport on Friday morning. He was reportedly flying a...
10 by Kristian Vättö on 2/4/2012
Patriot SSDs, Flash, and Large Memory Applications
Patriot has been supplying memory products for some time now, and they had the usual assortment of SSDs, RAM, USB, and other Flash products on display in their suite...
4 by Jarred Walton on 1/10/2012
Introducing AMD’s Memory Brand
We discussed the availability of AMD branded memory modules earlier this month, but today AMD is officially unveiling information on their memory platform. There are a few major questions...
55 by Jarred Walton on 11/28/2011
Rambus Loses Major Antitrust Case Against Hynix & Micron
There are few companies in the tech world as infamous as Rambus, an IP-only RAM development firm. For the better part of 10 years now they have been engaged...
29 by Ryan Smith on 11/16/2011
Intel and Micron Develop Hybrid Memory Cube, Stacked DRAM is Coming
During the final keynote of IDF, Intel's Justin Rattner demonstrated a new stacked DRAM technology called the Hybrid Memory Cube (HMC). The need is clear: if CPU performance is...
19 by Anand Lal Shimpi on 9/15/2011
Kingston Shows off Business SF-2281 SSD & 64GB Sandy Bridge E
I dropped by Kingston's booth at the IDF tech showcase to check out two things this evening: Kingston's SSDNow KC100 and another Sandy Bridge E demo. The KC100 is...
11 by Anand Lal Shimpi on 9/13/2011
JEDEC Reveals Key Aspects of DDR4
DDR3 made its debut in mid-2007 when Intel released P35 chipset with support for DDR3. Today nearly all desktop, mobile and server platforms support DDR3. iSuppli estimates that DDR3...
34 by Kristian Vättö on 8/23/2011
AMD to Enter RAM Market with Radeon-branded DDR3
AMD's website suggests that the company will be entering the RAM market soon with their own RAM modules. The modules will be branded as Radeon, just like AMD's GPUs...
23 by Kristian Vättö on 8/8/2011
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