Packaging

If there has been one prominent, industry-wide trend in chip design over the past half-decade or so, it has been the growing use of chiplets. The tiny dies have become an increasingly common feature as chip makers look to them to address everything from chip manufacturing costs to the overall scalability of a design. Be it simply splitting up a formerly monolithic CPU in to a few pieces, or going to the extreme with 47 chiplets on a single package, chiplets are already playing a big part in chip design today, and chip makers have made it clear that it’s only going to grow in the future. In the meantime, after over 5 years of serious, high-volume use, chiplets and the technologies underpinning them seem...

AMD: We’re Using an Optimized TSMC 5nm Process

When AMD started using TSMC’s 7nm process for the Zen 2 processor family that launched in November 2019, one of the overriding messages of that launch was that it...

44 by Dr. Ian Cutress on 1/10/2022

Intel's Process Roadmap to 2025: with 4nm, 3nm, 20A and 18A?!

In today’s Intel Accelerated event, the company is driving a stake into the ground regarding where it wants to be by 2025. CEO Pat Gelsinger earlier this year stated...

326 by Dr. Ian Cutress on 7/26/2021

Intel Accelerated Webcast on July 26th: Update on Process Technology and Roadmaps

Earlier this year, new Intel CEO Pat Gelsinger outlined his new ‘IDM 2.0’ vision for Intel. This vision was a three pronged strategy based on improving its own process...

32 by Dr. Ian Cutress on 7/12/2021

3DFabric: The Home for TSMC’s 2.5D and 3D Stacking Roadmap

Interposers. EMIB. Foveros. Die-to-die stacking. ODI. AIB.TSVs. All these words and acronyms have one overriding feature – they are all involved in how two bits of silicon physically connect...

9 by Dr. Ian Cutress on 9/2/2020

Intel Next-Gen 10-micron Stacking: Going 3D Beyond Foveros

One of the issues facing next-generation 3D stacking of chips is how to increase the density of the die-to-die interface. More connections means better data throughput, reducing latency and...

32 by Dr. Ian Cutress on 8/14/2020

Samsung Announces "X-Cube" 3D TSV SRAM-Logic Die Stacking Technology

Yesterday, Samsung Electronics had announced a new 3D IC packaging technology called eXtended-Cube, or “X-Cube”, allowing chip-stacking of SRAM dies on top of a base logic die through TSVs. Current...

21 by Andrei Frumusanu on 8/14/2020

AMD Discusses ‘X3D’ Die Stacking and Packaging for Future Products: Hybrid 2.5D and 3D

One of AMD’s key messages at its Financial Analyst Day 2020 is that the company wants to remain on the leading edge when it comes to process node technology...

12 by Dr. Ian Cutress on 3/5/2020

Intel's Interconnected Future: Combining Chiplets, EMIB, and Foveros

While Intel works on getting its main manufacturing process technology on track, it is spending just as much time and effort in researching and developing the rest of the...

117 by Ian Cutress on 4/17/2019

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