Micron this week published its financial results for the third quarter of its fiscal 2018 (ended on May 31), which also included an update concerning its non-volatile memory products and projects. The company confirmed that it is on track to start volume shipments of 96-layer 3D NAND chips (3rd Gen 3D NAND) in the second half of calendar 2018, and said that development of its 4th Gen 3D NAND is proceeding as planned without participation of Intel. At the same time, Micron indicated that sales of its 3D XPoint memory were well below expectations, which hurt the company financially because its fab remained underutilized. 64-Layer 3D NAND Progressing Well, 96-Layer Is On Track At present Micron is ramping up production of its 64-layer 3D TLC NAND...
Intel Launches Optane DIMMs Up To 512GB: Apache Pass Is Here!
Intel today announced the availability of their long-awaited Optane DIMMs, bringing 3D XPoint memory onto the DDR4 memory bus. The modules that have been known under the Apache Pass...74 by Ian Cutress & Billy Tallis on 5/30/2018