Semiconductors

TSMC has entered into a preliminary agreement with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding and access to up to $5 billion in loans under the CHIPS and Science Act. With this latest round of support from the U.S. government, TSMC in turn will be adding a third fab to their Arizona project, with its investment in the region soaring to more than $65 billion. This move not only signifies the largest foreign direct investment in Arizona but also marks one of the biggest support packages that the U.S. government plans to make under the CHIPS Act, second only to Intel's $8.5 billion award last month. TSMC is currently equipping its Fab 21 phase 1 and expects that it...

China Imposes New Export Restrictions on Gallium and Germanium

China this week formally imposed new export regulations on gallium and germanium, as well as materials incorporating them. This move is broadly seen as a retaliatory act for the...

6 by Anton Shilov on 8/2/2023

Dozens of Companies Adopt TSMC's 3nm Process Technology

Designing chips for modern, leading-edge manufacturing technologies is an expensive endeavor. Still, dozens of companies have already adopted TSMCs N3 and N3E (3 nm-class) fabrication processes, according to disclosures...

9 by Anton Shilov on 7/28/2023

Samsung Begins to Produce Third 3nm Chip Amid Massive Losses On DRAM & NAND

Samsung this week reported their financial results for the second quarter of 2023, closing the book on an especially bleak quarter of the year with a massive $3.4 billion...

14 by Anton Shilov on 7/28/2023

Rapidus Wants to Supply 2nm Chips to Tech Giants, Challenge TSMC

It has been a couple of decades since a Japanese fab has offered a leading-edge chip manufacturing process. Even to this day, none of the Japanese chipmakers have made...

19 by Anton Shilov on 7/26/2023

TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging

TSMC on Tuesday announced plans to construct a new advanced chip packaging facility in Tongluo Science Park. The company intends to spend around $2.87 billion on the fab that...

3 by Anton Shilov on 7/25/2023

TSMC: 3nm Chips for Smartphones and HPCs Coming This Year

While TSMC formally started mass production of chips on its N3 (3nm-class) process technology late last year, the company is set to finally ship the first revenue wafers in...

21 by Anton Shilov on 7/21/2023

TSMC Delays Arizona Fab Deployment to 2025, Citing Shortage of Skilled Workers

TSMC on Thursday disclosed that it will have to delay mass production at its Fab 21 in Arizona to 2025, as a lack of suitably skilled workers is slowing...

27 by Anton Shilov on 7/20/2023

Samsung Shipping First GAAFET Silicon; 3nm and 4nm Yields Are Improving - Report

Currently, only two foundries offer their customers 3 nm and 4 nm-class process technologies: TSMC and Samsung Foundry. But business media sometimes blames Samsung Foundry for mediocre yields on...

5 by Anton Shilov on 7/18/2023

Intel Foundry Services Readies Intel 16 Process: Low Power FinFET For Everyday Chips

Intel Foundry Services (IFS) this week soft-launched their new Intel 16 process technology, a 16nm-class node that will be used for the production of low-power chips for everyday workloads...

3 by Anton Shilov on 7/14/2023

Samsung Updates Foundry Roadmap: 2nm in 2025, 1.4nm in 2027

Samsung Foundry revealed its latest process technology roadmap today at its annual Samsung Foundry Forum (SFF) 2023. The company's SF2 (2 nm-class) production node is on track for 2025...

4 by Anton Shilov on 6/27/2023

Intel Sells a 20% Stake in Maker of Multi E-Beam Mask Writing Tools

Intel on Wednesday announced that it had agreed to sell a 20% stake in IMS Nanofabrication, a company the develops and builds multi e-beam photomask writing tools, for $860...

1 by Anton Shilov on 6/22/2023

Intel to Spend Tens of Billions on New Fabs in Germany and Israel

Intel is spending tens of billions of dollars on new fabs in Arizona and Oregon, but the company's ambitions certainly do not end in the U.S. This month the...

28 by Anton Shilov on 6/21/2023

Top 10 Foundries See Revenue Drop Nearly 15% Year-over-Year

The top 10 contract makers of chips saw their Q1 2023 revenue decline by 14.6% year-over-year and 18.6% quarter-over-quarter, according to the most recent report by TrendForce. The market...

0 by Anton Shilov on 6/13/2023

TSMC Opens Advanced Backend Packaging Fab for AI and HPC Products

TSMC on Friday formally opened its Advanced Backend Fab 6 facility, which it will be using to expand the company's capacity for building high-end, multi-chiplet products. The facility is...

1 by Anton Shilov on 6/9/2023

TSMC Shares More Info on 2nm: New MIM Capacitor and Backside PDN Detailed

TSMC has revealed some additional details about its upcoming N2 and N2P process technology at its European Technology Symposium 2023. Both production nodes are being developed with high-performance computing...

15 by Anton Shilov on 5/31/2023

TSMC Preps 6x Reticle Size Super Carrier Interposer for Extreme SiP Processors

As part of their efforts to push the boundaries on the largest manufacturable chip sizes, Taiwan Semiconductor Manufacturing Co. is working on its new Chip-On-Wafer-On-Substrate-L (CoWoS-L) packaging technology that...

2 by Anton Shilov on 5/26/2023

TSMC Details N4X Process for HPC: Extreme Performance at Minimum Leakage

At its 2023 Technology Symposium TSMC revealed some additional details about its upcoming N4X technology that is designed specifically for high-performance computing (HPC) applications. This node promises to enable...

5 by Anton Shilov on 5/26/2023

TSMC: We Have Working CFET Transistors in the Lab, But They Are Generations Away

Offering an update on its work with complementary field-effect transistors (CFETs) as part of the company's European Technology Symposium 2023, TSMC has revealed that it has working CFETs within...

3 by Anton Shilov on 5/25/2023

Samsung to Unveil Refined 3nm and Performance-Enhanced 4nm Nodes at VLSI Symposium

Samsung Foundry is set to detail its second generation 3 nm-class fabrication technology as well as its performance-enhanced 4 nm-class manufacturing process at the upcoming upcoming 2023 Symposium on...

3 by Anton Shilov on 5/10/2023

Samsung Foundry Vows to Surpass TSMC Within Five Years

The head of Samsung's semiconductor unit acknowledged last week that the company's current mass production, leading-edge process technologies are a couple of years behind TSMC's most advanced production nodes...

18 by Anton Shilov on 5/8/2023

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