TSMC

Currently the majority of high-end processors are monolithic, but design methodologies are slowly but surely shifting to multi-chiplet modules as leading-edge fabrication technologies get more expensive to use. In the coming years multi-chiplet system-in-packages (SiPs) are expected to become much more widespread, and advanced 2.5D and 3D chip packaging technologies will gain importance. To accelerate and simplify development of 3D designs, TSMC this week established its 3DFabric Alliance. While multi-chiplet SiPs promise to simplify development and verification of highly complex designs, they require brand-new development methodologies as 3D packages bring a number of new challenges. This includes new design flows required for 3D integration, new methods of power delivery, new packaging technologies, and new testing techniques. To make the best use of the benefits of...

TSMC and ASML: Demand for Chips Remains Strong, But Getting Fab Tools Is Hard

TSMC's revenue this year is going to set an all-time record for the company, thanks to high demand for chips as well as increased prices that its customers are...

13 by Anton Shilov on 7/21/2022

TSMC: N2 To Start With Just GAAFETs, Add Backside Power Delivery Later

When TSMC initially introduced its N2 (2 nm class) process technology earlier this month, the company outlined how the new node would be built on the back of two...

16 by Anton Shilov on 6/29/2022

TSMC to Customers: It's Time to Stop Using Older Nodes and Move to 28nm

We tend to discuss leading-edge nodes and the most advanced chips made using them, but there are thousands of chip designs developed years ago that are made using what...

20 by Anton Shilov on 6/29/2022

As HPC Chip Sizes Grow, So Does the Need For 1kW+ Chip Cooling

One trend in the high performance computing (HPC) space that is becoming increasingly clear is that power consumption per chip and per rack unit is not going to stop...

40 by Anton Shilov on 6/27/2022

TSMC to Expand Capacity for Mature and Specialty Nodes by 50%

TSMC this afternoon has disclosed that it will expand its production capacity for mature and specialized nodes by about 50% by 2025. The plan includes building numerous new fabs...

13 by Anton Shilov on 6/16/2022

TSMC Unveils N2 Process Node: Nanosheet-based GAAFETs Bring Significant Benefits In 2025

At its 2022 Technology Symposium, TSMC formally unveiled its N2 (2 nm class) fabrication technology, which is slated to go into production some time in 2025 and will be...

24 by Anton Shilov on 6/16/2022

TSMC Readies Five 3nm Process Technologies, Adds FinFlex For Design Flexibility

Taiwan Semiconductor Manufacturing Co. on Thursday kicked off its 2022 TSMC Technology Symposium, where the company traditionally shares it process technology roadmaps as well as its future expansion plans...

44 by Anton Shilov on 6/16/2022

AMD's Desktop CPU Roadmap: 2024 Brings Zen 5-based "Granite Ridge"

As part of AMD's Financial Analyst Day 2022, it has provided us with a look at the company's desktop client CPU roadmap as we advance towards 2024. As we...

37 by Gavin Bonshor on 6/9/2022

ASML High-NA Development Update: Coming to Fabs in 2024 - 2025

It took the semiconductor industry over a decade to prep everything needed for production of chips using extreme ultraviolet (EUV) lithography. It looks like it is going to take...

8 by Anton Shilov on 5/26/2022

TSMC Roadmap Update: N3E in 2024, N2 in 2026, Major Changes Incoming

Taiwan Semiconductor Manufacturing Co. has solid plans for the next few years, but the foundry's manufacturing technology design cycles are getting longer. As a result, to address all of...

21 by Anton Shilov on 4/22/2022

Universal Chiplet Interconnect Express (UCIe) Announced: Setting Standards For The Chiplet Ecosystem

If there has been one prominent, industry-wide trend in chip design over the past half-decade or so, it has been the growing use of chiplets. The tiny dies have...

25 by Ryan Smith on 3/2/2022

AMD: We’re Using an Optimized TSMC 5nm Process

When AMD started using TSMC’s 7nm process for the Zen 2 processor family that launched in November 2019, one of the overriding messages of that launch was that it...

44 by Dr. Ian Cutress on 1/10/2022

TSMC Unveils N4X Node: Extreme High-Performance at High Voltages

TSMC this week announced a new fabrication process that is tailored specifically for high-performance computing (HPC) products. N4X promises to combine transistor density and design rules of TSMC's N5-family...

42 by Anton Shilov on 12/17/2021

Semi CapEx to Hit $152 Billion in 2021 as Market on Track for $2 Trillion by 2035

Semiconductor makers have drastically increased their capital expenditures (CapEx) this year in response to unprecedented demand for chips that is going to last for years. Now the CEO of...

8 by Anton Shilov on 12/17/2021

AMD Gives Details on EPYC Zen4: Genoa and Bergamo, up to 96 and 128 Cores

Since AMD’s relaunch into high-performance x86 processor design, one of the fundamental targets for the company was to be a competitive force in the data center. By having a...

36 by Dr. Ian Cutress on 11/8/2021

TSMC Roadmap Update: 3nm in Q1 2023, 3nm Enhanced in 2024, 2nm in 2025

TSMC has introduced a brand-new manufacturing technology roughly every two years over the past decade. Yet as the complexity of developing new fabrication processes is compounding, it is getting...

32 by Anton Shilov on 10/18/2021

TSMC to Build Japan's Most Advanced Semiconductor Fab

Fabs are well-known for being an expensive business to be in, so any time a new fab is slated for construction, it tends to be a big deal &ndash...

14 by Anton Shilov on 10/15/2021

China's SMIC To Build a GigaFab for $8.87B: An Answer to the Shortages

As a result of being on the US Entity list, SMIC's blacklisting has caused troubles in the company developing and deploying leading-edge fabrication technologies. As a result, it has...

23 by Anton Shilov on 9/6/2021

Xilinx Expands Versal AI to the Edge: Helping Solve the Silicon Shortage

Today Xilinx is announcing an expansion to its Versal family, focused specifically on low power and edge devices. Xilinx Versal is the productization of a combination of many different...

25 by Dr. Ian Cutress on 6/9/2021

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